The System-on-Chip (SoC) is the key component in modern optical modules. It integrates multiple functional blocks into a single chip, including laser drivers, photodetector interfaces, modulation cont...
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By freeing up the silicon beachfront and embedding optical IO in the middle of the die, Photonic Fabric shatters the “beachfront” limitations of traditional SoCs. It delivers an exceptionally
These SoCs are suitable for use within QSFP-DD, OSFP and COBO module form factors. The integrated laser driver delivers greater than 1.8V of single-ended driver output swing necessary
The single-chip mixed-signal SoC integrates an Electronic Dispersion Compensation (EDC) engine and nonlinear DSP to compensate for chromatic dispersion in fiber cable up to 40 Km. Accelerate optical
Spica 800G PAM4 DSP Family, including the Spica Gen2 DSP, to enable 800G optical transceiver modules for hyperscale data centers and Al networks. Supports both Ethernet and InfiniBand
The System-on-Chip (SoC) is the key component in modern optical modules. It integrates multiple functional blocks into a single chip, including laser drivers, photodetector
MALTA, N.Y., May 4, 2026 – GlobalFoundries (Nasdaq: GFS) (GF) today announced the introduction of its SCALE™ optical module solution for co-packaged optics (CPO).
We developed a system-on-chip (SoC)-incorporated light-emitting diode (LED) and avalanche photodiode (APD) modules to improve the usability and flexibility of a fiberless wearable
Summary essfully interoperate at 400G with LPO modules, and the results exceed LPO-MSA version 1.0 specifications. FPGA-based NICs, combined with LPO modules, can significantly improve the Total
3U VPX module built on Versal Premium Adaptive SoC, delivering high-bandwidth optical I/O and dual QMC sites for advanced embedded processing systems.
The optical components used in these modules have the major functions of collimation, coupling, or focusing, and they are usually made with materials including optical glass, fused silica,
Prefabricated micro-modular data centers and edge pods, scalable from 5 to 50 racks, ready for 5G and edge AI workloads.
Single-phase immersion cooling tanks and direct-to-chip liquid cooling switches, achieving PUE below 1.1.
GPU-accelerated AI servers, high-density server racks, and network cabinets optimized for AI/ML workloads.
Real-time data center infrastructure management, plus overhead cable trays and fiber bridges for structured cabling.
We provide custom data center infrastructure solutions, from micro-modular DCs to immersion cooling and AI-ready racks.
From design to deployment, our team ensures energy-efficient, scalable, and carrier-grade digital infrastructure.
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