CSC Energia Data Infrastructure designs and delivers micro-modular data centers, edge data centers, immersion liquid cooling, AI servers, liquid cooling switches, cold aisle containment, DCIM/EMS, ser...
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Fibre Channel was designed as a serial interface to overcome limitations of the SCSI and HIPPI physical-layer parallel-signal copper wire interfaces.
Any device that needs to access the Fibre Channel network requires a corresponding network interface card (NAC), and the core of the network interface card is the interface control chip.
The new ultra high performance intelligent 4-lane PCIe 2.0 interface modules offer 2 ports with full function test, simulation, monitoring and analyzer functions for Fibre Channel networks.
“The Fibre Channel Industry Association (FCIA) is a mutual benefit, non-profit, international organization of manufacturers, system integrators, developers, vendors, industry
Fibre Channel hardware interconnects storage devices with servers to form the Fibre Channel fabric. The fabric consists of the physical layer, interconnect devices and translation devices.
Critical I/O''s Fibre Channel XMC products employ a silicon stack architecture which offloads most protocol processing for ultra high performance and provides broad protocol support such as SCSI
All L3Harris Network Interface Controllers (NIC) are compliant with the American National Standards Institute (ANSI) Fibre Channel standards. The predictable laten-cies and guaranteed delivery of Fibre
The ISP2100 is a single-chip, highly integrated, bus master, FC-AL processor that targets SCSI applications. This chip connects the PCI bus to a Fibre Channel loop and contains an onboard RISC
DX2 is the fourth member of the Agilent Technologies family of Fibre Channel interface controllers. It provides the performance enhancing features of PCI-X and is a single chip solution that offers the
The two-chip set (transmitter chip and receiver chip) is compatible with the FC-0 layer of the American National Standards Institute (ANSI), Fibre Channel specification, X3.230-1994.
Prefabricated micro-modular data centers and edge pods, scalable from 5 to 50 racks, ready for 5G and edge AI workloads.
Single-phase immersion cooling tanks and direct-to-chip liquid cooling switches, achieving PUE below 1.1.
GPU-accelerated AI servers, high-density server racks, and network cabinets optimized for AI/ML workloads.
Real-time data center infrastructure management, plus overhead cable trays and fiber bridges for structured cabling.
We provide custom data center infrastructure solutions, from micro-modular DCs to immersion cooling and AI-ready racks.
From design to deployment, our team ensures energy-efficient, scalable, and carrier-grade digital infrastructure.
Al. Jerozolimskie 180, Entrance B, 02-486 Warsaw, Masovian Voivodeship, Poland
+48 571 392 846 | +48 571 392 846 | [email protected]